2026阿聯(lián)酋·沙迦半導(dǎo)體展覽會(huì)
歡迎進(jìn)入阿聯(lián)酋沙迦半導(dǎo)體展覽會(huì)信息網(wǎng)，這里是阿聯(lián)酋半導(dǎo)體專業(yè)展會(huì)服務(wù)平臺(tái)，半導(dǎo)體展覽會(huì)屆時(shí)眾多知名品牌亮相，展示前沿產(chǎn)品與技術(shù)及創(chuàng)新解決方案，現(xiàn)場(chǎng)還將舉辦半導(dǎo)體行業(yè)的精彩活動(dòng)。
匯聚半導(dǎo)體業(yè)內(nèi)專業(yè)人士，把脈未來(lái)發(fā)展趨勢(shì)，引領(lǐng)行業(yè)不斷突破升級(jí)。阿聯(lián)酋沙迦展會(huì)信息還在實(shí)時(shí)更新中，請(qǐng)關(guān)注展務(wù)網(wǎng)了解更多展會(huì)信息。
展會(huì)列表
展會(huì)名稱展會(huì)時(shí)間展會(huì)地點(diǎn)
參展范圍
半導(dǎo)體設(shè)備: 半導(dǎo)體封裝設(shè)備、擴(kuò)散設(shè)備、焊接設(shè)備、清洗設(shè)備、測(cè)試設(shè)備、制冷設(shè)備、氧化設(shè)備等
半導(dǎo)體材料: 硅片、鍺硅材料、S01材料、太陽(yáng)能電池用硅材料及化合物半導(dǎo)體材料、石英制品、石墨制品、防靜電材料
產(chǎn)品及技術(shù): IC產(chǎn)品與應(yīng)用技術(shù)：IC產(chǎn)品與技術(shù)、IC測(cè)試方法與測(cè)試儀器、IC設(shè)計(jì)與設(shè)計(jì)工具、IC制造與封裝；集成電路終端產(chǎn)品；半導(dǎo)體光電器件；半導(dǎo)體分立器件產(chǎn)品與應(yīng)用技術(shù)
半導(dǎo)體技術(shù): 半導(dǎo)體先進(jìn)制造技術(shù)、半導(dǎo)體先進(jìn)密封技術(shù)、半導(dǎo)體工藝設(shè)備、半導(dǎo)體應(yīng)用材料、半導(dǎo)體元器件、半導(dǎo)體模塊制造商
半導(dǎo)體材料: 半導(dǎo)體封裝測(cè)試、IC制造、IC設(shè)計(jì)、EDA工具、LED工藝相關(guān)設(shè)備、材料、元器件
半導(dǎo)體設(shè)備: 工廠監(jiān)控系統(tǒng)、mems設(shè)備、材料、納米科技產(chǎn)品、自動(dòng)光學(xué)檢測(cè)系統(tǒng)、二手設(shè)備等
Semiconductor equipment: semiconductor packaging equipment, diffusion equipment, welding equipment, cleaning equipment, test equipment, refrigeration equipment, oxidation equipment
Semiconductor materials: silicon wafers, silicon materials, S01 materials, silicon materials for solar cells and compound semiconductor materials, quartz products, graphite products, anti-static materials
Products and technologies: IC products and application technologies: IC products and technologies, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging;
Semiconductor technology: Semiconductor advanced manufacturing technology, semiconductor advanced sealing technology, semiconductor process equipment, semiconductor application materials, semiconductor components, semiconductor module manufacturers
Semiconductor materials: semiconductor packaging testing, IC manufacturing, IC design, EDA tools, LED process-related equipment, materials, components
Semiconductor equipment: factory monitoring systems, mems equipment, materials, nanotechnology products, automatic optical inspection systems, second-hand equipment
為何參觀
參加2026半導(dǎo)體展覽會(huì)尋找新客戶，了解半導(dǎo)體行業(yè)創(chuàng)新和發(fā)展新趨勢(shì)，把握新商機(jī)
前往阿聯(lián)酋參加半導(dǎo)體展覽會(huì)請(qǐng)報(bào)名后根據(jù)展會(huì)時(shí)間提前辦理簽證
為何參展
2026半導(dǎo)體行業(yè)盛會(huì)，匯集全渠道買家，開拓阿聯(lián)酋市場(chǎng)的選擇，覆蓋半導(dǎo)體行業(yè)全產(chǎn)業(yè)鏈
半導(dǎo)體展覽會(huì)參展企業(yè)來(lái)自世界各地將新鮮、前沿的產(chǎn)品帶到現(xiàn)場(chǎng)
半導(dǎo)體展覽會(huì)還將邀請(qǐng)半導(dǎo)體領(lǐng)域?qū)＜液蜋?quán)威人士，通過(guò)全方位、深層次的交流，為全球建筑企業(yè)的商務(wù)拓展需求搭建商貿(mào)配對(duì)、互動(dòng)合作的廣闊平臺(tái)。
重要提醒：這是展務(wù)網(wǎng)專用招展信息，所列展會(huì)僅供參考，更多展會(huì)持續(xù)加入中，平臺(tái)只對(duì)會(huì)員提供對(duì)接服務(wù)！
